Hiroyuki Suda (Mr.) is a partner patent attorney in the Electronics & IT Section whose main responsibilities include patent prosecution and litigation with a specialty in polymer materials and semiconductors. He graduated from the Faculty of Engineering at Yamagata University earning both a B.S. and M.S. in polymer materials engineering. Having passed the patent bar examination in both Japan and the U.S., including the New York State bar examination, he has deep understanding of domestic and foreign patent prosecution. Mr. Suda is a member of the AIPPI-EJAPAN where he is Chief Editor of the AIPPI Journal. Additionally, he is a specially-appointed professor of Yamagata University and has written articles and conducted lectures on various topics including foreign filing in the U.S. and developments in Japanese IP law.